The VersaHybrid High-Precision Micro-Assembly Station is a versatile platform for optical and photonic device packaging, combining multiple bonding and assembly technologies in one system. It supports active alignment, adhesive bonding, soldering, welding, and mechanical mounting, enabling unmatched flexibility for both R&D and industrial production. With sub-micron positioning accuracy, integrated vision systems, and programmable automation, VersaHybrid ensures repeatable, high-quality results across diverse applications. Its modular design adapts easily to different processes, making it ideal for prototyping as well as scaling into high-volume production. By integrating multiple processes, VersaHybrid reduces complexity while improving efficiency and throughput.

Please contact us for the technical details : sales@unitedspectrum.in

Active Alignment Precision

Provides sub-micron accuracy for aligning fibres, laser diodes, and photonic integrated circuits (PICs).

Multi-Process Integration

Combines bonding, soldering, welding, and mechanical assembly in a single platform.

Programmable Automation

Supports recipe-based workflows, ensuring repeatability and reducing operator dependency.

Integrated Vision & Feedback

Machine vision and closed-loop control guarantee precise placement and quality assurance.

Modular & Scalable Platform

Adapts easily to laboratory prototyping or industrial manufacturing.

Advantages:

• Integrates multiple assembly and bonding methods in one station

• Sub-micron alignment ensures maximum optical coupling efficiency

• Scalable from R&D prototypes to high-volume production

• Reduces need for multiple machines, lowering costs and footprint

• Automation enhances throughput and product consistency

• Provides flexible process integration for photonic and optoelectronic devices

• Improves yield by reducing alignment and bonding errors

• Trusted across telecom, semiconductor, and biomedical industries for advanced packaging

Photonics & Optical Communications

Used for fibre coupling, PIC assembly, and transceiver packaging, ensuring stable, low-loss optical connections.

Semiconductor & Microelectronics

Supports hybrid integration of photonic and electronic chips, improving packaging precision and device miniaturisation.

Medical Devices

Applied in optical sensors, biomedical imaging modules, and diagnostic instruments requiring stable and precise bonding.

Aerospace & Defence

Supports ruggedised assemblies for communication modules, navigation systems, and advanced optical sensors.

Industrial Laser Systems

Used for assembly of diode lasers, fibre couplers, and micro-optical modules.

Automotive & EV Industry

Supports integration of LiDAR modules, in-cabin sensors, and ADAS photonic systems for autonomous driving.

Consumer Electronics & AR/VR

Applied in compact optical packaging for sensors, imaging devices, and AR/VR headsets.

Research & Development

Enables universities and labs to prototype novel PICs, hybrid assemblies, and packaging processes.

By combining multiple processes into a single system, the VersaHybrid station provides unmatched flexibility, reducing complexity while improving throughput and product stability in photonic and micro-assembly applications.

United Spectrum Instruments is the authorised distributor of Nanosystec’s VersaHybrid system in India, delivering advanced micro-assembly solutions with full support.

• Genuine VersaHybrid systems with manufacturer warranty

• Expertise across photonics, semiconductors, medical, and defence applications

• Pan-India installation, training, and after-sales service

• Consultation tailored for both R&D and industrial production

• Competitive pricing with trusted local expertise

With proven expertise in photonics and high-precision micro-assembly, United Spectrum Instruments ensures Indian industries and research organisations gain access to world-class hybrid assembly systems that deliver accuracy, flexibility, and long-term reliability.