Opto-Electronic Packaging Solutions – Wafer Testing System
High-Precision Characterization and Testing System for VCSEL Wafers and Chips
High-Density Photonic Integrated Circuits Characterization System for Optical and Electrical Testing
The High-Precision Characterization and Testing System for VCSEL Wafers and Chips is a comprehensive solution designed to evaluate the optical and electrical performance of VCSEL devices at both wafer and die level. Engineered for accuracy, automation, and repeatability, this system supports the entire VCSEL development lifecycle—from research and prototyping to high-volume production. By combining precision probing, optical measurement, temperature control, and advanced software automation, it enables reliable assessment of critical parameters such as output power, wavelength, LIV characteristics, and modulation behaviour. The result is higher yield, consistent quality, and faster time-to-market for VCSEL-based products.
Understanding High-Precision Characterization and Testing System for VCSEL Wafers and Chips
A VCSEL characterization and testing system integrates electrical probing, optical signal capture, and data analysis into a single automated platform. VCSEL wafers or individual chips are positioned with nanometre-scale accuracy, while probes and fibres align precisely to each device. The system performs controlled electrical stimulation and captures optical responses, generating detailed performance metrics across temperature and operating conditions. Automated wafer mapping and test recipes allow rapid comparison across devices, making it ideal for process optimisation, binning, and quality control in advanced photonics and semiconductor manufacturing environments.
Technical Specifications
Please contact us for the technical details : sales@unitedspectrum.in
Key Features and Advantages
Nanometre-Scale Motion and Probing Accuracy
High-resolution stages and precision probes ensure accurate electrical contact and repeatable optical alignment across entire wafers.
Comprehensive Optical and Electrical Characterisation
Supports LIV curves, optical power measurement, wavelength analysis, SMSR evaluation, and voltage-current profiling in a single workflow.
Temperature-Controlled Testing
Programmable chuck temperature enables full thermal characterisation, essential for reliability testing in telecom, automotive, and consumer electronics.
High-Speed and RF Test Capability
Compatible with external RF and network analysers to evaluate modulation bandwidth and small-signal response of high-speed VCSELs.
Machine Vision–Based Alignment
Integrated vision systems provide automated probe and fibre alignment, reducing setup time and operator dependency.
Wafer-Level and Chip-Level Flexibility
Supports full wafers as well as singulated chips, allowing use across R&D, pilot lines, and production environments.
Advanced Data Mapping and Analysis
Colour-coded wafer maps, real-time plotting, and exportable datasets simplify defect identification and yield analysis.
Automation-Ready Architecture
Optional robotic handling and recipe-driven testing enable unattended operation and scalable throughput.
Software-Driven Process Control
Intuitive software manages test sequences, stores device data, and integrates with factory databases or external analysis tools.
Applications Across Industries
Telecom and Datacom VCSEL Manufacturing
Characterisation of VCSEL arrays used in optical interconnects, transceivers, and active optical cables with high repeatability.
3D Sensing and Consumer Electronics
Testing VCSELs for facial recognition, time-of-flight sensing, and AR/VR systems under realistic operating conditions.
Automotive and LiDAR Systems
Thermal and performance validation of VCSELs used in driver monitoring, short-range LiDAR, and in-cabin sensing.
Biomedical and Diagnostic Optics
Low-power and wavelength-stable testing for VCSELs used in imaging, spectroscopy, and medical diagnostics.
Semiconductor Backend and Packaging
Wafer sorting, die binning, and post-assembly validation for hybrid and co-packaged photonic devices.
Research and Academic Laboratories
Flexible platform for developing new VCSEL designs, studying thermal effects, and performing comparative device analysis.
Photonics Prototyping and Pilot Lines
Rapid evaluation of small batches during process development and scale-up phases.
Why Choose United Spectrum Instruments?
United Spectrum Instruments brings deep expertise in photonics testing and semiconductor characterisation systems to customers across India. We support VCSEL manufacturers and research organisations with application-driven system configuration, on-site installation, training, and long-term service. Our local technical team understands VCSEL fabrication challenges and works closely with users to optimise test workflows, improve yield, and accelerate production readiness. Choosing United Spectrum Instruments means partnering with a reliable distributor committed to precision, performance, and responsive after-sales support.
FAQs
Can the system test both wafers and individual VCSEL chips?
Yes, it supports full wafer-level probing as well as single-die testing.
What parameters can be measured?
Optical power, wavelength, LIV curves, voltage, current, and high-speed modulation response.
Is temperature-dependent testing supported?
Yes, the system includes a programmable temperature-controlled chuck.
Can it be integrated into automated production lines?
Yes, it is automation-ready with optional robotic handling and software integration.
Is the software adaptable to custom test requirements?
Absolutely. Test recipes, data formats, and interfaces can be customised for R&D or production needs.
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Have Any Questions ?
FAQs
Can the system test both wafers and individual VCSEL chips?
Yes, it supports full wafer-level probing as well as single-die testing.
What parameters can be measured?
Optical power, wavelength, LIV curves, voltage, current, and high-speed modulation response.
Is temperature-dependent testing supported?
Yes, the system includes a programmable temperature-controlled chuck.
Can it be integrated into automated production lines?
Yes, it is automation-ready with optional robotic handling and software integration.
Is the software adaptable to custom test requirements?
Absolutely. Test recipes, data formats, and interfaces can be customised for R&D or production needs.




