Opto-Electronic Packaging Solutions – Wafer Testing System
Advanced Optical and Electrical Characterization System for Silicon Photonics Wafers
Silicon Photonics Wafer Characterization System for Advanced Optical and Electrical Testing
United Spectrum Instruments is the official distributor of the NanoTest SiP-Wafer system in India. This advanced characterisation and testing platform is engineered for high-throughput, high-precision measurement of Silicon Photonics (SiP) wafers. It combines optical probing, electrical testing, automated wafer handling, and machine vision inspection in one integrated system—ideal for research labs, pilot lines, and volume production.
Understanding Advanced Optical and Electrical Characterization System for Silicon Photonics Wafers
The NanoTest SiP-Wafer is a specialised characterisation system designed for wafer-level testing of silicon photonics (SiP) devices. It combines optical probing, electrical testing, and precision alignment to validate device performance directly on wafers before dicing and packaging. With sub-micron positioning accuracy, advanced vision systems, and automated workflows, the system ensures fast, reliable, and repeatable results. Supporting comprehensive measurements such as insertion loss, coupling efficiency, IV curves, and high-speed electrical testing, the NanoTest SiP-Wafer accelerates R&D and production workflows. Its modular design makes it equally suitable for research institutions, semiconductor fabs, and photonic device manufacturers.
Technical Specifications
Please contact us for the technical details : sales@unitedspectrum.in
Key Features and Advantages
Wafer-Level Testing
Designed specifically for characterisation of silicon photonics devices at the wafer stage.
Automated Active Alignment
Provides sub-micron accuracy for fibre-to-chip and probe alignment.
Comprehensive Test Suite
Performs optical transmission, insertion loss, coupling efficiency, IV curves, and thermal stability testing.
Programmable Automation
Recipe-driven workflows ensure repeatability and reduce operator intervention.
Vision & Monitoring Systems
Integrated cameras and feedback systems improve reliability and throughput.
Scalable Modular Design
Supports both R&D prototyping and high-volume semiconductor manufacturing.
Advantages:
Dedicated for silicon photonics wafer-level testing
Combines optical and electrical characterisation in one platform
Sub-micron alignment ensures precision and reliability in measurements
Early detection of defects improves overall yield and reduces costs
Automated workflows increase throughput and reduce human error
Modular configuration scales from academic labs to semiconductor fabs
Comprehensive testing ensures device reliability across telecom and datacom applications
Trusted by industry leaders in photonics and semiconductor manufacturing
Applications Across Industries
Photonics & Optical Communications
Validates silicon photonics devices for DWDM, optical transceivers, and coherent communication systems.
Semiconductor & Microelectronics
Supports wafer-level testing of PICs and hybrid chips, enabling high-volume manufacturing with reduced defect rates.
Data Centres & Cloud Infrastructure
Ensures that photonics-based interconnects and transceivers meet bandwidth, latency, and power efficiency targets.
Aerospace & Defence
Applied in wafer-level testing of secure communication modules and photonic sensors for mission-critical applications.
Research & Development
Universities and labs use it to characterise prototype silicon photonics wafers, accelerating innovation in next-generation PIC architectures.
Industrial Laser Systems
Supports validation of SiP devices integrated with lasers and modulators for precision manufacturing.
Medical & Biophotonics
Applied in photonics-based biomedical devices, optical sensors, and lab-on-chip testing.
Automotive & EV Industry
Used for wafer-level validation of PICs integrated into LiDAR and optical sensors for autonomous vehicles.
By enabling precise wafer-level validation, the NanoTest SiP-Wafer reduces development costs, improves yield, and accelerates the commercialisation of silicon photonics technologies.
Why Choose United Spectrum Instruments?
United Spectrum Instruments is the authorised distributor of Nanosystec’s NanoTest SiP-Wafer system in India, delivering advanced wafer-level photonic testing solutions with complete support.
Genuine NanoTest SiP-Wafer systems with full manufacturer warranty
Expertise in photonics, semiconductor, and telecommunications industries
Pan-India installation, training, and after-sales technical support
Application-specific consultation for both research and production setups
Competitive pricing with dependable local expertise
With proven knowledge in photonics and semiconductor testing, United Spectrum Instruments ensures Indian industries and research organisations access world-class wafer characterisation systems for precision, yield improvement, and long-term reliability.
FAQs
What wafer sizes are supported?
The system supports up to 12-inch SiP wafers, with options for smaller wafers or singulated chips.
Can the system perform high-speed testing for production lines?
Yes, with the OptoSpin module and automated wafer handling, it’s designed for high-throughput environments.
Is the wafer chuck temperature adjustable?
Yes, the chuck operates from -20°C to +100°C, with a nitrogen purge option to prevent icing.
Which optical fibres are supported?
Both single-mode fibres and fibre arrays are supported, depending on your photonic device interface.
What is the typical alignment accuracy?
The system achieves submicron precision using linear encoders and motorised stages.
GET IN TOUCH WITH US
Have Any Questions ?
FAQs
What wafer sizes are supported?
The system supports up to 12-inch SiP wafers, with options for smaller wafers or singulated chips.
Can the system perform high-speed testing for production lines?
Yes, with the OptoSpin module and automated wafer handling, it’s designed for high-throughput environments.
Is the wafer chuck temperature adjustable?
Yes, the chuck operates from -20°C to +100°C, with a nitrogen purge option to prevent icing.
Which optical fibres are supported?
Both single-mode fibres and fibre arrays are supported, depending on your photonic device interface.
What is the typical alignment accuracy?
The system achieves submicron precision using linear encoders and motorised stages.





