Opto-Electronic Packaging Solutions – Wafer Testing System
Optical and Electrical Characterization System for High-Density Photonic Integrated Circuits (PICs)
High-Density Photonic Integrated Circuits Characterisation System for Optical and Electrical Testing
United Spectrum Instruments is the authorised distributor of the NanoTest PIC-HD system in India. Designed to address the increasing complexity of photonic integrated circuits (PICs), the system offers unmatched performance in both optical and electrical characterisation. With nanometre-level precision, advanced automation, and seamless integration with industrial workflows, the NanoTest PIC-HD is the ideal solution for research, prototyping, and mass production testing of next-generation opto-electronic devices.
Understanding Optical and Electrical Characterization System for High-Density Photonic Integrated Circuits (PICs)
The NanoTest PIC-HD is a state-of-the-art characterisation system engineered for high-density photonic integrated circuits (PICs). It combines optical probing, electrical testing, and automated alignment to deliver fast, repeatable, and precise measurements. With sub-micron positioning accuracy, integrated vision, and programmable workflows, the system enables comprehensive validation of PIC performance under real-world operating conditions. Its modular design supports multiple device formats, from wafers to packaged chips, making it suitable for both R&D and production environments. By reducing manual intervention and increasing throughput, NanoTest PIC-HD accelerates innovation in optical communications, semiconductor manufacturing, and advanced photonic device development.
Technical Specifications
Please contact us for the technical details : sales@unitedspectrum.in
Key Features and Advantages
High-Density PIC Testing
Supports optical and electrical characterisation of densely packed photonic integrated circuits.
Automated Active Alignment
Provides sub-micron accuracy for fibre-to-chip and electrical probe alignment.
Comprehensive Testing Capability
Performs optical loss measurements, coupling efficiency, IV curves, and high-speed electrical testing.
Programmable Workflows
Automates test procedures for repeatability and higher throughput.
Vision & Feedback Systems
Integrated imaging and monitoring tools ensure precise, reliable measurements.
Scalable Modular Design
Adapts easily to R&D labs and industrial production setups.
Advantages:
Dedicated for testing high-density photonic integrated circuits (PICs)
Combines optical probing and electrical characterisation in one platform
Sub-micron alignment improves accuracy and repeatability
Automation reduces operator dependency and increases throughput
Modular configuration scales from prototypes to volume production
Comprehensive test suite covers optical, electrical, and thermal validation
Ensures higher yield by detecting failures early in development
Trusted solution for telecom, datacom, and semiconductor industries
Applications Across Industries
Photonics & Optical Communications
Validates PICs used in high-speed optical transceivers, DWDM systems, and coherent communication modules.
Semiconductor & Microelectronics
Supports wafer-level and packaged chip testing, ensuring device reliability and scalability for commercial production.
Data Centres & Cloud Infrastructure
Ensures PIC-based transceivers and interconnects meet bandwidth and efficiency requirements for high-speed networks.
Aerospace & Defence
Tests ruggedised photonic devices for satellite communications, secure networks, and sensing systems.
Research & Development
Universities and labs use it for prototyping new PIC architectures, enabling faster innovation cycles.
Industrial Laser Systems
Evaluates integrated photonic chips for laser diode drivers, coupling efficiency, and power monitoring systems.
Medical Devices & Biophotonics
Applied in optical sensors, biomedical imaging systems, and lab-on-chip devices using photonic integration.
Automotive & EV Industry
Used in PIC-based LiDAR, optical sensors, and communication modules for ADAS and autonomous driving systems.
The NanoTest PIC-HD delivers comprehensive optical and electrical testing, making it indispensable for industries that rely on precise validation of high-density photonic circuits.
Why Choose United Spectrum Instruments?
United Spectrum Instruments is the authorised distributor of Nanosystec’s NanoTest PIC-HD system in India, offering advanced PIC testing and characterisation solutions with complete support.
Genuine NanoTest PIC-HD systems with manufacturer warranty
Expertise in photonics, telecommunications, and semiconductor industries
Pan-India installation, training, and after-sales technical support
Application-specific consultation for R&D and industrial testing setups
Competitive pricing with dependable local expertise
By partnering with United Spectrum Instruments, Indian industries and research organisations gain access to world-class characterisation platforms that ensure accuracy, efficiency, and long-term value in photonic innovation.
FAQs
What types of PICs can be tested using NanoTest PIC-HD?
It supports a wide variety of PIC types, including silicon photonics, indium phosphide-based devices, VCSEL arrays, modulators, photodetectors, and laser diodes.
Can the system handle both R&D and production-scale volumes?
Yes, the NanoTest PIC-HD is modular and supports both small-batch testing for R&D and fully automated, high-throughput workflows for production.
Is the system compatible with external test automation software?
Yes. TestMaster software integrates easily with MATLAB, Python, LabVIEW, and other industry-standard test automation tools.
What are the fibre coupling options supported?
Both passive and active coupling are supported, with high-precision XYZ and rotational alignment stacks for maximising coupling efficiency.
Does the system offer temperature-controlled testing?
Yes. It allows device-level temperature settings between 20°C to 80°C with fast response heating elements for quick cycling.
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FAQs
What types of PICs can be tested using NanoTest PIC-HD?
It supports a wide variety of PIC types, including silicon photonics, indium phosphide-based devices, VCSEL arrays, modulators, photodetectors, and laser diodes.
Can the system handle both R&D and production-scale volumes?
Yes, the NanoTest PIC-HD is modular and supports both small-batch testing for R&D and fully automated, high-throughput workflows for production.
Is the system compatible with external test automation software?
Yes. TestMaster software integrates easily with MATLAB, Python, LabVIEW, and other industry-standard test automation tools.
What are the fibre coupling options supported?
Both passive and active coupling are supported, with high-precision XYZ and rotational alignment stacks for maximising coupling efficiency.
Does the system offer temperature-controlled testing?
Yes. It allows device-level temperature settings between 20°C to 80°C with fast response heating elements for quick cycling.



