The NanoPlace Active Alignment and Assembly Station is a precision micro-assembly platform designed for fast and reliable packaging of photonic and optoelectronic devices. With sub-micron positioning accuracy, machine vision guidance, and automated workflows, it ensures stable coupling of fibres, lenses, laser diodes, and photonic integrated circuits (PICs). The system integrates alignment, bonding, and assembly into one compact station, enabling both research prototyping and scalable production. NanoPlace reduces operator dependency, improves yield, and ensures repeatability. Its modular design makes it ideal for laboratories and industrial facilities focused on high-performance photonic packaging and micro-assembly applications.

Please contact us for the technical details : sales@unitedspectrum.in

Active Alignment Precision

Achieves sub-micron accuracy for coupling and integration of photonic and optical components.

Integrated Assembly Processes

Combines alignment, bonding, and placement in a single automated platform.

Vision & Feedback Control

Machine vision and closed-loop feedback ensure accuracy and quality.

Programmable Automation

Supports recipe-driven processes for repeatable, high-throughput production.

Compact & Modular Build

Adapts easily to R&D setups or industrial production environments.

Advantages:

• Sub-micron precision for reliable photonic and micro-optical assemblies

• Integrates alignment, bonding, and assembly into one workflow

• Automated processes reduce human error and operator dependency

• Modular system scales from laboratory prototyping to volume manufacturing

• Ensures consistent product quality and long-term stability

• Improves throughput and efficiency in photonic packaging processes

• Compact footprint saves valuable space in production facilities

• Trusted solution for PICs, fibre optics, and optoelectronic integration

Photonics & Optical Communications

Used for fibre coupling, photonic integrated circuit (PIC) packaging, and transceiver assembly, ensuring low-loss optical connections.

Semiconductor & Microelectronics

Supports micro-optical alignment and hybrid integration of chips, enhancing packaging precision.

Medical Devices

Applied in the production of biomedical instruments, imaging systems, and miniature optical sensors requiring precise alignment.

Aerospace & Defence

Used in ruggedised photonic assemblies, navigation systems, and optical communication modules where reliability is critical.

Research & Development

Supports universities and labs developing next-generation PICs, micro-optics, and photonic packaging techniques.

Industrial Laser Systems

Facilitates assembly of laser diode arrays, fibre coupling units, and micro-optical components.

Automotive & EV Industry

Applied in LiDAR modules, optical sensors, and communication devices essential for ADAS and autonomous driving systems.

Consumer Electronics & AR/VR

Supports compact optical module assembly for AR/VR headsets, cameras, and sensors in portable devices.

The NanoPlace system combines speed, accuracy, and automation, making it an essential solution for industries requiring high-performance photonic packaging and assembly.

United Spectrum Instruments is the authorised distributor of Nanosystec’s NanoPlace Assembly Station in India, offering advanced alignment and assembly solutions with complete support.

• Genuine NanoPlace systems with full manufacturer warranty

• Expertise across photonics, semiconductors, telecom, and biomedical industries

• Pan-India installation, training, and after-sales service

• Application-focused consultation for R&D and industrial production setups

• Competitive pricing with dependable local expertise

By working with United Spectrum Instruments, Indian industries and research organisations gain access to world-class assembly platforms like NanoPlace that deliver accuracy, reliability, and long-term performance.