Opto-Electronic Packaging Solutions – Active Alignment System
Glueing Station for Laser diodes, Photonics circuits and Opto-electronic Packaging
The Glueing Station for Laser Diodes, Photonic Circuits and Opto-Electronic Packaging – Nano Glue is a high-precision alignment and bonding solution engineered for modern photonics manufacturing. Designed to meet the stringent demands of miniaturised optical and opto-electronic assemblies, this system integrates nanometre-level positioning, automated adhesive dispensing, and controlled curing in a single platform. It enables accurate, repeatable bonding of sensitive components such as laser diodes, VCSELs, photodiodes, and photonic integrated circuits. Ideal for both R&D environments and scalable production, the system delivers consistent optical performance, reduced assembly time, and higher manufacturing yield.
Understanding Glueing Station for Laser diodes, Photonics circuits and Opto-electronic Packaging
A glueing station for opto-electronic packaging combines ultra-precise motion control, machine vision, and automated resin handling to align and permanently bond optical components with sub-micron accuracy. Components are positioned in multiple degrees of freedom while optical power, alignment markers, or vision feedback ensure optimal placement. Once aligned, controlled adhesive volumes are dispensed and cured using UV or thermal processes without disturbing the alignment. This approach eliminates manual variability, ensures stable optical coupling, and supports complex assemblies required in laser diode modules, silicon photonics, and advanced optical packaging.
Technical Specifications
Please contact us for the technical details : sales@unitedspectrum.in
Key Features and Advantages
Nanometre-Level Alignment Accuracy
High-resolution linear and rotary stages enable precise positioning critical for laser diodes, VCSEL arrays, and photonic circuits.
Active and Passive Alignment Capability
Supports vision-based passive alignment as well as active alignment using optical power feedback for maximum coupling efficiency.
Automated Adhesive Dispensing
Precisely dispenses epoxy or resin from nanolitre to millilitre volumes, ensuring uniform bond lines and repeatable results.
Integrated UV and Thermal Curing
Flexible curing options allow compatibility with a wide range of UV-curable, dual-cure, and heat-curing adhesives.
Advanced Machine Vision System
High-resolution cameras with adjustable optics and lighting enable detection of fine optical features, fiducials, and component edges.
Multi-Axis Motion Control
Full control across translational and rotational axes enables complex 3D alignment for edge-coupling, grating coupling, and free-space optics.
Tray-Based and Batch Processing
Efficient tray handling improves throughput, reduces handling errors, and supports scalable production workflows.
Software-Driven Automation
Intuitive software allows recipe creation, barcode-based process selection, and seamless integration with automation or MES systems.
Repeatability and Process Stability
Automated sequences ensure consistent results across batches, improving yield and long-term reliability of optical assemblies.
Applications Across Industries
Laser Diode and VCSEL Module Assembly
Precision alignment and bonding of laser emitters to optics, fibres, and submounts for stable optical output and thermal performance.
Silicon Photonics and PIC Packaging
Accurate die-to-waveguide alignment, fibre attachment, and bonding of photonic chips with minimal insertion loss.
Optical Communication Systems
Assembly of transceivers, multiplexers, and fibre-coupled modules used in data centres and telecom networks.
LiDAR and 3D Sensing Modules
High-accuracy bonding of VCSEL arrays, detectors, and optical elements for automotive and consumer sensing applications.
Research and Development Laboratories
Rapid prototyping of experimental optical assemblies, free-space optics, and custom photonic setups.
Semiconductor and Advanced Packaging
Chip-to-substrate bonding, hybrid integration, and heterogeneous packaging of optical and electronic components.
Medical and Sensing Devices
Assembly of optical sensors, diagnostic modules, and biomedical photonic systems requiring stable alignment and clean bonding.
Why Choose United Spectrum Instruments?
United Spectrum Instruments delivers advanced glueing and alignment stations for photonic and opto-electronic packaging with strong local expertise in India. We support customers from application evaluation and system configuration to installation, training, and after-sales service. Our deep understanding of laser diodes, silicon photonics, and optical assembly processes ensures optimal system selection and faster time-to-production. By partnering with United Spectrum Instruments, customers gain access to proven technology, responsive technical support, and scalable solutions tailored to both R&D and industrial manufacturing needs.
FAQs
What components can be assembled using this glueing station?
Laser diodes, VCSELs, photodiodes, optical fibres, lenses, and photonic integrated circuits can all be aligned and bonded.
Does the system support active optical alignment?
Yes, it supports active alignment using optical power or detector feedback for maximum coupling efficiency.
Which curing methods are available?
UV curing is standard, with optional thermal curing for specialised adhesives.
Is the system suitable for cleanroom use?
Yes, it is designed for cleanroom environments and minimises manual handling through tray-based workflows.
Can the system be scaled for production?
Absolutely. Automated sequences, batch handling, and software control make it suitable for low- to high-volume manufacturing.
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FAQs
What components can be assembled using this glueing station?
Laser diodes, VCSELs, photodiodes, optical fibres, lenses, and photonic integrated circuits can all be aligned and bonded.
Does the system support active optical alignment?
Yes, it supports active alignment using optical power or detector feedback for maximum coupling efficiency.
Which curing methods are available?
UV curing is standard, with optional thermal curing for specialised adhesives.
Is the system suitable for cleanroom use?
Yes, it is designed for cleanroom environments and minimises manual handling through tray-based workflows.
Can the system be scaled for production?
Absolutely. Automated sequences, batch handling, and software control make it suitable for low- to high-volume manufacturing.
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