Industrial Laser System – Laser Micro Machining System

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Picosecond Laser Micro-Ablation Machine

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Picosecond Laser Micro-Ablation Machine for Ultrafast, High-Precision Micro-Machining Applications

As manufacturing shifts toward ultra-precision, miniaturisation, and non-contact processing, the Picosecond Laser Micro-Ablation Machine has become a critical tool for advanced micro-machining. Using ultrashort picosecond laser pulses, this system enables controlled material removal with exceptional accuracy and minimal thermal impact. Unlike conventional machining or long-pulse lasers, picosecond laser ablation preserves surrounding material integrity while achieving clean, sharp micro-features. Designed for demanding industrial and R&D environments, this technology supports high-precision processing across electronics, medical devices, aerospace, automotive, and energy applications.

A Picosecond Laser Micro-Ablation Machine operates by delivering extremely short laser pulses—measured in trillionths of a second—to remove material through cold ablation rather than melting. This process limits heat diffusion, ensuring precise, repeatable micro-structuring without cracks, burrs, or recast layers. Integrated CNC motion, high-accuracy positioning, and intuitive control software allow complex 2D and 3D patterns to be produced with micron-level precision. The result is a versatile, high-speed micro-machining platform suitable for delicate substrates, multilayer structures, and high-value components.

ParameterSpecification
Laser TypeFemtosecond or Picosecond Laser (optional Fibre)
Wavelength1030 nm / 1064 nm / 515 nm (configurable)
Pulse Duration<300 fs to 10 ps
Power Output10 W – 100 W
Min Feature SizeDown to 10 μm
Position Accuracy±5 μm
Ablation SpeedUp to 1000 mm/s
Cooling SystemAir or Water cooled
Control SoftwareCNC with GUI, parameter presets, diagnostics

Ultrashort Picosecond Pulse Technology

Picosecond pulses enable highly localised material removal, delivering clean ablation with minimal thermal influence on adjacent areas.

Micron-Scale Precision

The system supports feature sizes down to approximately 10 microns, ideal for intricate patterning and fine surface structuring.

Minimal Heat-Affected Zone

Cold ablation prevents melting, warping, or micro-cracks, making the process safe for sensitive layers, coatings, and thin films.

Multi-Material Processing Capability

Efficiently ablates metals, ceramics, glass, polymers, dielectrics, thin films, and composite materials with consistent quality.

High-Speed Industrial Throughput

Ablation speeds of up to 1000 mm/s enable both rapid prototyping and high-volume industrial production.

Advanced CNC Control and Diagnostics

User-friendly CNC software with graphical interfaces allows precise control of pulse energy, repetition rate, focus depth, and scan paths.

Excellent Edge Quality and Surface Finish

Produces smooth edges and low surface roughness, reducing or eliminating the need for secondary finishing processes.

Eco-Friendly and Clean Process

No chemicals, consumables, or mechanical tools are required, resulting in a clean and sustainable manufacturing workflow.

Medical Device Manufacturing

Used for stent structuring, implant surface texturing, microchannels for drug delivery, catheter marker bands, and surgical tool refinement.

Electronics and Semiconductor Fabrication

Ideal for micro-via formation, thin-film patterning, redistribution layer structuring, flexible PCB processing, and photonic device fabrication.

Solar Cell and Energy Technologies

Supports P1, P2, and P3 scribing, selective ablation of transparent conductive layers, and fine patterning for advanced solar architectures.

Aerospace and Defence

Applied in micro-patterning of composites, selective coating removal, sensor aperture creation, and precision surface modification.

Automotive and Electric Vehicles

Used for injector micro-features, MEMS sensors, airbag components, battery coating ablation, and precision trimming of electronic modules.

Luxury Goods and Watchmaking

Enables intricate engraving, decorative micro-textures, sapphire and ceramic structuring, and anti-counterfeit micro-features.

United Spectrum Instruments delivers advanced Picosecond Laser Micro-Ablation Machines tailored to the evolving needs of Indian industry and research institutions. Beyond equipment supply, we provide application consultation, system customisation, installation, operator training, and long-term service support. Our strong expertise in ultrafast laser micro-machining ensures reliable performance, faster adoption, and scalable solutions. Partnering with United Spectrum Instruments means working with a technology provider committed to precision, productivity, and future-ready manufacturing excellence.

FAQs

Yes, it allows precise removal of single or multiple layers with minimal disruption to the substrate.

Absolutely. It handles materials like glass, sapphire, and ceramics with ultrafast precision and minimal micro-cracks.

Yes. Systems are designed for Class 1000 or better, with options for HEPA-filtered enclosures.

 

Femtosecond lasers minimise heat transfer, eliminate burrs, and allow for sub-micron resolution.

Yes, integration with robotic handlers, conveyor systems, or PLCs is supported for inline manufacturing.

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FAQs

Yes, it allows precise removal of single or multiple layers with minimal disruption to the substrate.

Absolutely. It handles materials like glass, sapphire, and ceramics with ultrafast precision and minimal micro-cracks.

Yes. Systems are designed for Class 1000 or better, with options for HEPA-filtered enclosures.

 

Femtosecond lasers minimise heat transfer, eliminate burrs, and allow for sub-micron resolution.

Yes, integration with robotic handlers, conveyor systems, or PLCs is supported for inline manufacturing.

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