A Picosecond Laser Micro-Scribing Machine utilises ultrashort laser pulses—measured in trillionths of a second—to precisely remove or modify material through controlled ablation. This process limits thermal diffusion, allowing accurate scribing of thin films and multi-layer structures without damaging underlying layers. Integrated CNC motion systems ensure exact positioning and smooth scanning paths, enabling complex patterns and dense geometries. The result is a versatile, non-contact micro-machining platform capable of delivering fine features, high throughput, and exceptional process stability across a wide range of materials and applications.

Ultrashort Picosecond Pulse Processing

Picosecond pulses enable clean, precise scribing with minimal heat transfer, preserving material properties and functional layers.

Sub-10 Micron Feature Resolution

The system supports extremely fine scribe lines, making it ideal for high-density circuits, thin-film devices, and micro-scale components.

Minimal Heat-Affected Zone

Cold ablation prevents melting, delamination, or micro-cracking, ensuring high-quality results on sensitive or layered substrates.

Wide Material Compatibility

Effectively scribes metals, semiconductors, ceramics, glass, polymers, transparent conductive oxides, and composite films.

High-Speed Industrial Performance

Scribing speeds of up to 1000 mm/s support both rapid prototyping and scalable production without compromising precision.

Advanced CNC Motion and Control

Multi-axis motion with intuitive graphical interfaces allows programmable patterns, repeatable results, and complex geometry execution.

Clean, Non-Contact Manufacturing

No mechanical tools, no consumables, and no chemical processing result in lower maintenance, reduced contamination, and sustainable operation.

Automation-Ready Architecture

Designed for integration into automated production lines with support for inline inspection, robotic handling, and process monitoring.

Electronics and Semiconductor Manufacturing

Used for wafer scribing, thin-film patterning, microvia definition, flexible circuit processing, and photonic device fabrication.

Medical Device Manufacturing

Enables precise scribing of microfluidic channels, implantable electrodes, surgical tools, and biocompatible substrates with clean finishes.

Solar Cell and Photovoltaic Production

Supports P1, P2, and P3 scribing, edge isolation, and selective patterning of transparent conductive layers in thin-film solar cells.

Aerospace and Defence

Applied for micro-patterning of composites, traceability marking, sensor calibration features, and precision surface modification.

Automotive Electronics and Sensors

Used for scribing thin-film coatings, sensor elements, MEMS devices, and electronic modules used in advanced vehicle systems.

Micro-Optics and Photonics

Ideal for waveguide definition, optical circuit structuring, micro-lens patterning, and photonic integrated circuit processing.

Luxury Goods and Watchmaking

Supports fine engraving, decorative micro-patterns, serial marking, and aesthetic detailing on metals, ceramics, and sapphire.

Research and Development

Widely used for rapid prototyping, experimental material studies, microchannel fabrication, and academic research applications.

United Spectrum Instruments delivers advanced Picosecond Laser Micro-Scribing Machines tailored to the evolving needs of Indian industry and research institutions. Beyond supplying equipment, we provide expert application consultation, system customisation, installation, operator training, and long-term service support. Our deep understanding of ultrafast laser processes ensures faster implementation, reliable performance, and scalable solutions. Partnering with United Spectrum Instruments means gaining a trusted technology partner committed to precision manufacturing, productivity, and future-ready microfabrication capabilities.